CEVA to Showcase Next-Generation 4G and Multimedia Technologies at Mobile World Congress

LTE, 3D video, gesture recognition and mobile audio and voice technologies on display from the world's #1 licensor of DSP cores and platforms; Visit CEVA in Stand 1F33, Hall 1 at Mobile World Congress 2011

MOUNTAIN VIEW, Calif. -- Feb. 2, 2011 -- CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets, today announced that it will showcase its leadership in mobile intellectual property through a range of new and innovative communication and multimedia technologies at Mobile World Congress 2011 in Barcelona, Spain from February 14th through 17th. CEVA will be located at stand 1F33 in Hall 1.

Demonstration platforms on display at CEVA's stand include:

Software-defined LTE user equipment demo – Together with CEVAnet partner mimoOn GmbH, CEVA will demonstrate a live 20Mbps transport of HD video streams over LTE using MIMO2*2 and 64QAM. This LTE UE demonstration is based on a commercially available solution, now in design with leading wireless vendors. The UE solution incorporates the CEVA-XC processor running mimoOn's mi!MobilePHY™ software over CEVA's LTE and communication library functions.
Multiview Video Coding (MVC) demo – CEVA will demonstrate MVC decoder with stereoscopic view (3D) in HD resolution, implemented fully in software on the CEVA-MM3000 video & imaging processing platform. In addition, an HD H.264 decoder will be demonstrated, emphasizing the true multi-standard nature of the platform.
Gesture Recognition, Natural User Interface demo – Together with CEVAnet partner eyeSight Mobile Technologies, CEVA will demonstrate gesture recognition, face detection and video decoding running simultaneously on the CEVA-MM2000 multimedia platform.
Multi-microphone noise cancellation demo – Together with CEVAnet partner Alango Technologies, CEVA will demonstrate beam-forming voice technology running on the CEVA-TeakLite-III DSP. This technology creates an acoustic bubble (handset mode) or acoustic sector (speakerphone mode) which significantly reduces background noise, wind and other interference and improves voice clarity.

At the show, more than sixty CEVA licensees, partners and OEMs will display CEVA-powered™ products and solutions, including Broadcom, Ericsson, Intel Mobile Communications, LG, Mediatek, Nokia, Mindspeed, Rockchip, Samsung, ST-Ericsson, Sony Ericsson, Ubiquisys, Vodafone and ZTE. New CEVA-powered products debuting at the show will include feature phones, smartphones, tablets, notebooks, machine-to-machine wireless modules, eReaders, and femtocells.

CEVA dominates the DSP licensing market with a 78% market share^ and is the world's #1 deployed DSP architecture in cellular baseband processing, powering 36% of all baseband processors shipped in Q3 2010^^. With more than thirty five wireless customers powering 2G, 3G and 4G solutions, CEVA DSPs have shipped in more than 1 billion cellular baseband processors to date, including the world's first commercially deployed LTE modems from Samsung. To learn more about CEVA's industry-leading technologies and how they can enhance your next-generation processor designs, visit the CEVA booth at stand 1F33 in Hall 1.

To request a meeting with CEVA at Mobile World Congress 2011, please email sales@ceva-dsp.com.

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.

^Source: The Linley Group - Mobile and Wireless Semiconductor Market Share 2009, June 2010

^^Source: Strategy Analytics – Baseband Market Share Tracker, December 2010