English
Xilinx CTO: FPGA can drive the crossover SoC
Peter Clarke, EETimes
2/2/2011 6:12 PM EST
SANTA CLARA, Calif. – Ivo Bolsens, chief technology officer of field programmable gate array vendor Xilinx Inc., sees a future where FPGAs are a fundamental part of the system-on-chip, either merged monolithically with software programmable microprocessor cores or making use of multi-die configurations in three dimensional system-in-packages.
Speaking as a keynoter at the DesignCon conference here, Bolsens laid out the concept of the crossover SoC as something similar to the crossover automobile, which combines the attributes of a sports car, passenger vehicle and a station wagon.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Xilinx, Inc. Hot IP
Related News
- APIs can help handle FPGA complexity, says Xilinx CTO
- Aldec Introduces End-to-end HW/SW Co-verification for Xilinx Zynq SoC FPGAs at Embedded World 2017
- Sercos IP Core for Xilinx 7 Series FPGAs and Zynq SoC Family Available
- Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-Processing SoC Technologies
- Microsemi Integrates Inicore Enhanced Reliability CAN IP into SmartFusion2 SoC FPGA
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation