Cadence exec: EDA needs 'breakaway value'
Peter Clarke, EETimes
2/2/2011 11:31 AM EST
SANTA CLARA, Calif. – EDA has got a challenge on its hands, but that is one of the things that attracted John Bruggeman to join Cadence Design Systems Inc. as chief marketing officer. He was previously CMO with embedded software company Wind River Systems.
Bruggeman, speaking to EE Times at the DesignCon conference here, reckons there is a lot of churn in the EDA market as difficult, expensive or even failing projects are causing semiconductor companies to throw out incumbent suppliers and try a different design flow. The complexity of design at 40-nm, 28-nm and down to 20-nm is also driving a transition from a pick-and-mix best-in-class approach to a single supplier or few supplier strategy, Bruggeman said. And, of course, such changes and the negotiations associated with them, are one of the mechanisms by which the chip companies bear down on the pricing.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Cadence Design Systems Appoints John Bruggeman as Chief Marketing Officer
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
- Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
- Cadence Achieves EDA Certification for TSMC 5nm and 7nm+ FinFET Process Technologies to Facilitate Mobile and HPC Design Creation
- Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors
Breaking News
- Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications
- CAES Gaisler Signs Contract with the European Space Agency for New Advanced Space Processor
- Pinnacle Imaging Systems Announces Denali 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit
- Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge
- Synopsys Unleashes PrimeSim Continuum Solution to Accelerate the Design of Hyper-Convergent ICs for Memory, AI, Automotive and 5G Applications
Most Popular
- TSMC certifies Aprisa place-and-route solution from Siemens on TSMC's N6 process
- TSMC Boosts Capital Budget Again, to $30B
- Expedera Introduces Its Origin Neural Engine IP With Unrivaled Energy-Efficiency and Performance
- Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
- Groq Closes $300 Million Fundraise