mimoOn and Tensilica Demonstrate Atlas LTE Platform for Mobile SDR Baseband at MWC 2011
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, CA -- February 09, 2011- mimoOn, a pioneer in LTE (Long Term Evolution) software implementation for programmable radio platform, and Tensilica®, the number one LTE IP (Intellectual Property) core provider, will be demonstrating their market-leading hardware and software for mobile SDR (software-defined radio) baseband at Mobile World Congress, February 14 - 17, 2011, in Barcelona, in Tensilica's booth 1F39 and in mimoOn's pavilion, #99 on the main avenue.
The demonstration showcases mimoOn's mi!MobilePHY™ software, a full-featured and certified LTE software solution for user equipment (handsets) that supports mandatory and optional features in the 3GPP Release 8 standard. With a flexible and scalable architecture, advanced algorithms and roadmap for future 3GPP releases, mimoOn's mi!MobilePHY™ adds to the already outstanding features and performance of the Tensilica solution.
The Tensilica-based hardware system showcases Atlas LTE downlink functionality, showing end-to-end video content transfer and playback. The demonstration uses Tensilica's ConnX BBE16 DSP (digital signal processor) core, coupled with the newly introduced ConnX SSP16 and ConnX Turbo16 dataplane processors (DPUs) to implement a complete user equipment LTE PHY downlink system. All required functionality is implemented in the Tensilica cores and there is no need for any external hardware blocks, as in other implementations, since Tensilica DPUs are scalable and can range from small, function-specific micro DPUs/DSPs to high-performance DSPs and can be customized to deliver 10x to 100x speed/power improvements.
"The combination of the Atlas platform and a pre-integrated and validated LTE PHY from mimoOn delivers significant design cycle efficiencies and improves time-to-market for customers, which in 2011, will be a major competitive advantage with the accelerated deployment of LTE," stated Brian Robertson, vice president of sales & marketing at mimoOn.
"Tensilica's reference platform enables customers to quickly and easily implement their LTE design without the need to take care of LTE PHY integration by themselves. Removing this effort from our customers enables them to focus on delivering solutions to the market in an accelerated manner," stated Eric Dewannain, Tensilica's vice president and general manager, Baseband Business Unit.
About mimoOn
mimoOn GmbH, headquartered in Dusseldorf, Germany, is a world leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile phones and devices, small cell basestations (Pico/Femto) and IP development in the areas of SON, schedulers and Radio Resource management.
mimoOn partners with leading silicon & DSP IP vendors, providing a complete HW & SW platform for OEM's to develop and commercialize their products. mimoOn provides a complete porting, optimization and verification service, as well as a roadmap to future 3GPP releases. For more information, visit www.mimoOn.de.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10x to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- mimoOn and Tensilica Offer Complete LTE PHY Reference Platform for User Equipment and eNodeB PHY at Mobile World Congress 2012
- SimpLight Achieves First LTE Modem Silicon Success Using Tensilica's Complete ATLAS Reference Platform
- New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
- Tensilica Announces Availability of Atlas Reference Architecture Dataplane Processors for a Complete Baseband PHY for LTE, HSPA+ and WiMAX
- Xilinx to Demonstrate Its Targeted Design Platforms for Radio and Baseband Processing at Mobile World Congress 2011
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |