English
MIT, TI tip 28-nm processor
Mark LaPedus, EETimes
2/20/2011 9:05 PM EST
SAN FRANCISCO - At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
In a paper, TI and MIT will present research detailing design methodologies for a 28-nm mobile applications processor with ultra-low power. The paper-entitled ''A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY
- New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation
- Adapteva close to sampling 28-nm, 64-core coprocessor
- Altera Introduces SoC FPGAs: Integrating ARM Processor System and FPGA into 28-nm Single-Chip Solution
- Improved ARM core, other changes in TI mobile app processor
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation