English
Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
SEMI book-to-bill slips
Mark LaPedus, EETimes
2/22/2011 6:34 PM EST
SAN JOSE, Calif. – North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.85 in January, down from 0.90 in December, according to SEMI.
A book-to-bill of 0.85 means that $85 worth of orders were received for every $100 of product billed for the month. The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- North American Semiconductor Equipment Industry Posts January 2015 Book-to-Bill Ratio of 1.03
- North American Semiconductor Equipment Industry Posts January 2014 Book-to-Bill Ratio of 1.04
- North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14
- North American Semiconductor Equipment Industry Posts January 2012 Book-to-Bill Ratio of 0.95
- North American Semiconductor Equipment Industry Posts October 2016 Book-to-Bill Ratio of 0.91
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation