InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
KING OF PRUSSIA, Pa.-- February 24, 2011 -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent holding subsidiaries have previously entered into a worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with SII Mobile Communications Inc., a subsidiary of Seiko Holdings Corporation, headquartered in Japan. The agreement covers the sale of SII's wireless products, including 2G and 3G Machine-to-Machine (M2M) modules and PC Cards.
"We are pleased to add SII Mobile Communications to our growing list of licensees," said Lawrence F. Shay, President of InterDigital's patent holding subsidiaries. "With the signing of this new customer, we continue the licensing momentum we have shown over the last eighteen months. Over that time frame, we entered into a dozen new agreements and amendments, adding to our solid base of customers paying recurring royalties and continuing our expansion into new market segments."
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and partnerships with many of the world's leading wireless companies.
InterDigital is a registered trademark of InterDigital, Inc.
For more information, visit: www.interdigital.com
|
Related News
- InterDigital Signs Casio Hitachi Mobile Communications to Worldwide 2G and 3G Patent License Agreement
- InterDigital Signs Acer to Worldwide Patent License Agreement
- InterDigital Signs Pantech to Worldwide Patent License Agreement Covering 2G, 3G and LTE Standards
- InterDigital Signs Cinterion to Worldwide Patent License Agreement
- InterDigital Signs ModeLabs to Worldwide 2G and 3G Patent License Agreement
Breaking News
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
- Powering the NVM and Embedded Chip Security Technologies
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
Most Popular
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
- Quobly announces key milestone for fault-tolerant quantum computing
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Alphawave IP - Announcement regarding leadership transition
E-mail This Article | Printer-Friendly Page |