InterDigital to Deliver SlimChip Modem Core to New Entrant to Mobile Chipset Market in China

KING OF PRUSSIA, Pa.-- February 28, 2011-- InterDigital, Inc. (NASDAQ: IDCC) today announced that its subsidiary, InterDigital Communications, LLC, previously entered into an agreement to provide its SlimChip™ 2G and 3G modem technology to a new entrant to the mobile chipset market in Mainland China. "Being selected by an ambitious company with a solid technology background in wireless chipsets provided further validation of the competitiveness of our SlimChip modem technology," said William J. Merritt, Chief Executive Officer of InterDigital. "This customer has strengthened our position as an independent provider of advanced modem solutions and opens the door for continued success in China on several fronts." Under the non-exclusive technology delivery agreement, InterDigital has provided 2G and 3G physical layer dual mode modem technology - inclusive of HSPA, compliant with the UMTS 3GPP Release 6 standard. In exchange, InterDigital is receiving milestone-based payments and will also be compensated on the basis of sales of products containing the delivered technology.

About InterDigital

InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and partnerships with many of the world's leading wireless companies. For more information, please visit www.InterDigital.com.