Norihiro Satsukawa, EETimes
3/1/2011 5:09 PM EST
TOKYO – Sony Corp., best known for its consumer products but also a chip supplier, revealed to EE Times Japan that they have been successfully mass-producing high-end processors with coreless substrate packaging technology.
“We started to use coreless packages in mass-production of Cell processors for PlayStation3 since April 2010 and have shipped more than 3 million units,” Tomoshi Ohde, general manager, advanced LSI assembly product department at Sony’s semiconductor business group, said during a recent one-on-one with EE Times Japan.
Ohde claims this level of mass-production of coreless packaged semiconductor products is a worldwide first.
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