32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
Gain enters analog IC market with physical-layer transceiver for USB 2.0
Gain enters analog IC market with physical-layer transceiver for USB 2.0
By Semiconductor Business News
February 27, 2002 (4:14 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020227S0048
SAN FRANCISCO -- Gain Technology Corp. rolled out its first analog front-end interface chip for high-speed USB peripherals during the Intel Developer Forum here this week. The GT3200 is compliant with the USB 2.0 Transceiver Macrocell Interface (UTMI) specification, said Gain, which is based in Tucson, Ariz. The GT3200 represents Gain's entry into the analog IC market. The device is a physical-layer transceiver supporting 480-megabit-per-second transmissions on the Universal Serial Bus. The transceiver can be configured for use as either an 8- or 16-bit interface, said privately-held Gain. Packaged in a 64-lead quad flatpack, the GT3200 is priced at $3.49 each in 10,000 piece quantities. The chip is now available and being sampled by customers. During the next 12-to-18 months, Gain plans to introduce additional high-performance serial transceiver chips for transport speeds exceeding multi-gigabit/sec. data rates. These transceivers will address Serial ATA (15 to 600 Mbits/sec.), Infiniband (3.125 Gbits/sec.), 3GIO and other PHY technologies for next-generation PCs, servers, storage systems, and peripherals. "There is a clear industry shift from aging legacy interfaces to new, robust high-speed serial standards, such as USB 2.0, 3GIO and Serial ATA," noted Steve Millaway, CEO and founder of Gain Technology. He said these high-speed interfaces make it more difficult to find suitable analog front-end functions for systems. Gain is also offering a complementary USB 2.0 macrocell for ASICs and system-on-chip designs. The GT3100 core is available on advanced foundry processes, including technologies from Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and United Microelectronics Corp. (UMC).
Related News
- inSilicon and Cadence Design Systems Unite to Develop Integrated USB 2.0 Analog Transceiver
- Cypress Introduces Low-Cost USB 2.0 Transceiver
- Gain Technology Unveils Silicon-Verified USB 2.0 PHY Transceiver Core
- VinChip and Altera to Provide USB 2.0 Cores To The Embedded Market
- Synopsys and Gain Technology Partner to Deliver Complete USB 2.0 Solution in DesignWare IP Library
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |