SANTA CLARA, Calif.-- May 26, 2011 --eASIC Corporation, a provider of NEW ASIC devices, today announced that Pankaj Patel, Cisco Senior Vice President of Engineering has joined eASIC’s Board of Directors.
“I am very excited to join eASIC’s Board of Directors. eASIC has a proven, disruptive technology that adds significant value to their customers by displacing power hungry and costly FPGAs or lowering the development cost of traditional ASICs,” said Pankaj Patel. “At a point when many companies in high growth markets are implementing cost reduction strategies to improve gross margins and competitiveness, eASIC is ideally positioned to have a dramatic impact in the custom logic arena.”
“We are very excited to have Pankaj join our Board of Directors,” said Ronnie Vasishta, President and CEO of eASIC. “As a seasoned senior executive, Pankaj brings a unique and valuable engineering, and business management expertise gained at a combination of highly successful small, medium and large enterprises. His experience in growing and scaling businesses will be immensely valuable to eASIC, as we expand our market footprint and continue our aggressive revenue ramp primarily from tier one wired, wireless and storage infrastructure customers.”
Patel’s role at Cisco encompasses development, strategy and execution of its $32 billion product portfolio, as well as go-to-market strategies and customer value propositions for its $10 billion Service Provider business. Prior to Cisco, Patel has held senior management positions at Apollo Computer/HP, Digital Equipment Corporation, Stratacom and Redback. From 1999 to 2003, Patel was Senior Vice President of Engineering at Redback Networks and responsible for all products at Redback Networks. Patel holds a master’s degree in electrical engineering from the University of Wisconsin-Madison and a bachelor’s degree in engineering from Birla Institute of Technology and Science in Pilani, India.
About eASIC Corporation
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com.