Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Alvand Collaborates with GLOBALFOUNDRIES to Provide Analog Mixed-Signal IP for Wireless MIMO Applications
Santa Clara, California (June, 08, 2011)-- Alvand Technologies, Inc. a leading analog and mixed signal IP provider, today announced that GLOBALFOUNDRIES has chosen to collaborate with Alvand to develop semiconductor IP for the foundry’s 40nm process nodes. GLOBALFOUNDRIES, a leading provider of advanced semiconductor technology and manufacturing services, is widely recognized as one of the world’s leading independent semiconductor foundries.
“By collaborating with IP developers such as Alvand Technologies, we can help our customers accelerate their time-to-revenue through the use of proven analog IP cores,” said Dave Steer, Director of IP Business Development at GLOBALFOUNDRIES. “Our processes are customized for the highest levels of performance at the lowest possible power, a critical requirement for mobile applications. Alvand has ported their existing proven complex analog IP to GLOBALFOUNDRIES’ process to meet our rigorous IP qualification standards. Together, we will serve the market for next-generation smartphones and high-speed wireless communications.”
As part of this collaboration, Alvand developed a MIMO (multiple-input, multiple-output) Wireless AFE (analog front end) IP core in the GLOBALFOUNDRIES 40LP process. This MIMO AFE is designed for integration into LTE, WiMAX, WiFi SoC (system-on-chip) solutions. Major sub-components in the Wireless AFE, including a 12-bit 80 MHz IQ ADC, a 12-bit 80/260/320 MHz IQ DAC, a 10-bit ADC and a 10-bit DAC, are also being qualified.
“Alvand seeks to partner with the most trusted foundries in the world. With a rapidly expanding fab presence on three continents, GLOBALFOUNDRIES is clearly one of the industry’s leading players,” explained Dr. Mansour Keramat, CEO and founder of Alvand Technologies. “With its advanced technology and high-volume production capabilities, GLOBALFOUNDRIES is at the forefront of chip manufacture for the latest smartphone and mobile products. This agreement initiates a relationship with GLOBALFOUNDRIES that will enable Alvand Technologies to help deploy the next-generation of global wireless solutions.”
Alvand has also joined the GLOBALSOLUTIONS ecosystem program. GLOBALSOLUTIONS is an open and collaborative program to leverage the best IP, EDA, design services, mask making and assembly and test resources from around the world to deliver optimized solutions to GLOBALFOUNDRIES’ customers.
About Alvand Technologies
“Alvand Technologies offers best-in-class (ADC/DAC) and Analog Front End technologies in advanced deep-submicron manufacturing, available in 28nm, 40nm, 65nm, 90nm, 130nm and 180nm process nodes at TSMC, UMC and GLOBALFOUNDRIES. Alvand's wireless MIMO and Video AFE IP cores have been licensed in over 20 products currently in mass production.”
Alvand Technologies is privately held and is located in Santa Clara, California. For more information visit us at http://www.alvandtech.com.
|
Related News
- Alvand Technologies Offers Analog Mixed-Signal IP in 28nm Process
- GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
- Alvand Technologies Announce tape-out of its compact, low-power Wireless MIMO Analog Front End in 40nm
- Alvand Technologies Announces Advanced Wireless MIMO Analog Front End Platform for LTE/WiMAX Application
- ChipIdea, a leading analog and mixed-signal IP and SoC solutions provider, announces a new generation of analog front-ends (AFEs) for 802.11 Wireless LAN applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |