Fractional-N Integer LC DESKEW PLLs in FDSOI FDX (GF22FDX SS28FDS ST28FD-SOI 22FDX 28FDS)
Tensilica Licensees Ship One Billionth IP Core, Projected to Reach Two Billion Cores in 2012
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, CA-- Jun 8, 2011 - Tensilica,® Inc. today announced that it reached a milestone in May 2011 with the production of over one billion Tensilica DPUs (dataplane processor units). Tensilica's licensees are currently shipping at a run rate exceeding 500 million Tensilica DPUs per year, and Tensilica projects its customers will hit the two billion cumulative shipment mark by the end of 2012 -- a doubling in volume in just 18 months.
"While I'm excited about hitting this important milestone, I'm even more excited about how bright our future looks," stated Jack Guedj, Tensilica's president and CEO. "We reached this milestone with virtually no unit shipments in LTE, where we have significant design wins that have yet to reach production."
The growth in unit shipments is a direct result of Tensilica's investments in standard cores for the high-volume mobile wireless and home entertainment markets combined with high-volume custom designs in the PC and video/imaging markets. DPUs from Tensilica combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. They are used for the signal processing-intensive tasks such as audio, video, and communications in SOC (system-on-chip) designs.
"Tensilica is at a point where the company could really take off," stated Will Strauss, president of Forward Concepts and leading DSP analyst. "It quickly jumped to a formidable position in baseband DSP IP cores for LTE and has the leading audio DSP core. And their customers really appreciate the ability to customize the cores for their exact applications."
"I want to thank our customers for their broad adoption of Tensilica products as well as all of the Tensilica employees, who have invested their hearts and minds into creating our leadership products and providing stellar support to our customers," stated Guedj.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Tensilica Licensees Ship Two Billion IP Cores; License Revenue Now Larger than Any Other DSP Licensing Company
- Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
- Gartner Says Worldwide Semiconductor Sales to Reach $311 Billion in 2013, a 4.5 Percent Increase from 2012
- Sonics Licensees Shipments Surpass Two Billion Units
- Global Semiconductor Sales Grow at Fastest Rate in Almost Two Years on Sequential Monthly Basis, Top $24 Billion for First Time in 2012
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |