Infineon teams with Austria's NewLogic in wireless LAN licensing pact
Infineon teams with Austria's NewLogic in wireless LAN licensing pact
By Semiconductor Business News
March 7, 2002 (10:06 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020307S0014
MUNICH -- Infineon Technologies AG here and Austria's NewLogic Technologies AG today announced a cross-licensing and royalty agreement for intellectual property (IP) used in wireless local area network products. The two companies said the pact will help Infineon speed development of wireless LAN products while supporting expansion of NewLogic's IP portfolio. Munich-based Infineon plans to incorporate NewLogic's IP design cores and technology in new products and software for IEEE 802.11a and 802.11b networks. NewLogic, based in Lustenau, Austria, said it will include Infineon's IEEE 802.11 signal processing technology in its intellectual property for wireless LANs. "This agreement will extend and elevate our long-standing relationship with NewLogic," said Ulrich Hamann, chief executive officer of Infineon's Wireless Solutions Group. "NewLogic's broad portfolio of wireless intellectual property will contribute to the acceleration of Infineon's dev elopment of leading-edge products for tomorrow's mobile Internet services and will help to address the diversity of devices delivering these future services in all wireless applications," he added. Wireless LAN technology was incorporated in about 8 million PCs and laptop units in 2001, and that total is expected to reach 50 million computer users by 2005, according to a forecast from Dataquest Inc., cited by Infineon and NewLogic. The agreement with Infineon is NewLogic's largest licensing pact so far, said Hans-Peter Metzler, chief executive officer of the five-year-old company. "By licensing today's platforms and cooperating on next-generation product definition, we can deliver a comprehensive set of solutions into next generation high growth volume markets," said Metzler, who founded NewLogic in May 1997. Prior to the startup's launch, Metzler was vice president of the Microcontroller Division at Siemens Semiconductor Group--which is now Infineon. Terms of the cross-licensing and royalty agre ement were not released.
Related News
- Cadence Selects Wipro-Newlogic's Wireless LAN IP For Its SoC Functional Verification Kit
- Cadence Selects Wipro-NewLogic's Wireless LAN IP for its Low-Power Methodology Kit
- Infineon takes 20% stake in Austria's NewLogic
- Intel to Acquire Infineon's Wireless Solutions Business
- Lantiq's New Wireless LAN Chips Set Benchmarks for Reach and Robustness
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |