Analyst: yield drove Globalfoundries change
Peter Clarke, EETimes
6/21/2011 7:28 AM EDT
LONDON – Management changes recently announced at Globalfoundries Inc. are related to problems with 32-nm chip yield and the slowness of creating a foundry-like operation at Globalfoundries' Dresden facility in Germany, according to analysts at Nomura Equity Research.
Globalfoundries announced June 16 that Doug Grose, CEO and Chia Song Hwee, COO, would be stepping down from their posts and the appointment of Ajit Manocha as interim CEO. Globalfoundries itself cited "demands from customers for more capacity, faster technology development and greater agility," in its press release.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Opinion: AMD roadmap change benefits TSMC?
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
- SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core
- indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
- GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation