PCI Express takes on Thunderbolt
Rick Merritt, EETimes
6/22/2011 6:06 PM EDT
SANTA CLARA, Calif. – The PCI Special Interest Group will launch an effort in July to created a cabled version of PCI Express that will take on the Thunderbolt interconnect developed by Intel and Apple. Backers suggest the PCIe approach will be more open and more optimal than Thunderbolt for delivering high throughput I/O to tablets and thin notebooks.
The new cable will be based on PCIe 3.0 which supports up to 8 GTransfers/second. It likely will support a maximum of four parallel lanes for throughput up to 32 Gbits/s and distances no longer than three meters.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- TI introduces industry's first family of ICs designed to support Thunderbolt Technology
- Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology
- PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
- Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
- PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation