32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
PCI Express takes on Thunderbolt
Rick Merritt, EETimes
6/22/2011 6:06 PM EDT
SANTA CLARA, Calif. – The PCI Special Interest Group will launch an effort in July to created a cabled version of PCI Express that will take on the Thunderbolt interconnect developed by Intel and Apple. Backers suggest the PCIe approach will be more open and more optimal than Thunderbolt for delivering high throughput I/O to tablets and thin notebooks.
The new cable will be based on PCIe 3.0 which supports up to 8 GTransfers/second. It likely will support a maximum of four parallel lanes for throughput up to 32 Gbits/s and distances no longer than three meters.
E-mail This Article | Printer-Friendly Page |
Related News
- TI introduces industry's first family of ICs designed to support Thunderbolt Technology
- Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology
- PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
- Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip
- PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
Breaking News
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process