videantis announces 40nm low-power silicon success with multi-core, multi-standard video processing solution
Hannover, Germany - June 29, 2011 - videantis GmbH has successfully realized a multi-core, multi-standard high-definition (HD) video processing solution in the most advanced high-performance 40nm low-power CMOS technology together with Infineon Technologies (now Intel Mobile Communications). The working silicon is available since end of 2010.
The multi-core chip was developed by videantis and is especially designed for high-definition video, multimedia, and safety applications in energy-aware environments such as mobile or automotive application domains. The IC integrates the third generation of a complete video subsystem including the firmware-upgradeable v-MP4280HDX multi-standard high-definition video IP solution, occupying only 4.28 mm2 of the die area.
By combining a set of innovative low-power design approaches such as selective reading for reduced memory activity, fine-grain clock gating to dynamically disable inactive processing units, and special low-power instruction set extensions, a break-through in low power consumption is achieved with only 5mW for a single video core at an operating frequency of 400MHz. Additional power management features implemented include voltage islands with power gating, and multiple internal clocks.
Leveraging videantis' unique programmable stream and video engine architectures, the chip supports all relevant video compression standards including H.264/AVC, MVC, MPEG-4, DivX, Xvid, WMV9/VC-1, MPEG-2, H.263, RealVideo, Sorenson, On2 VP6, and Google VP8/WebM Project in full HD quality, and is upgradeable per firmware update to future upcoming standards on the same device. Besides video compression and decompression, it is further ideally suited for advanced application-specific video processing solutions such as high-quality multi-format video transcoding, high-end frame rate conversion for mobile and consumer applications, robust video stabilization for mobile environments, and optimized OpenCV-based face and gesture recognition as well as image and video processing libraries for advanced automotive driver assistance applications such as adaptive cruise control, lane detection, vehicle detection or night vision.
The videantis video processor was developed and tested based on the 40nm platform technology of Infineon Technologies (now Intel Mobile Communications). It combines excellent chip performance for most advanced applications at very low power consumption with a design system fostering first-time-right realizations.
About videantis
videantis GmbH of Hannover, Germany, is a one-stop video IP and solution provider delivering flexible multi-standard HW/SW video solutions for mobile, consumer, and automotive markets. Based on a proprietary video processor platform that is licensed to chip manufacturers, videantis provides tailored solutions to meet the specific needs of their customers. With its core competencies of deep video application expert know-how and strong SoC design and system architecture expertise, videantis serves a worldwide customer basis with a wide range of target applications, such as mobile TV, Internet-connected set-top box, or in-car infotainment systems. For more information about videantis, please visit http://www.videantis.com.
|
videantis GmbH Hot IP
Related News
- Brite Semiconductor Achieves First-Pass Silicon Success with SMIC's 40nm Process
- videantis introduces new scalable video solutions up to HD for mobile devices
- Infineon and videantis announce 65nm platform verification with multi-standard video processing solution
- RDA Selects Chips&Media's HD video technology for Mobile AP and DTV Platforms
- videantis licenses multi-standard video IP to BOSCH
Breaking News
- Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
- Industry R&D Spending To Rise 4% After Hitting Record in 2020
- Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
- Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
Most Popular
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
- TSMC Boosts Capital Expenditure Budget on Strong Outlook
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
- Value of Semiconductor Industry M&A Agreements Sets Record in 2020
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |