Setting the record straight on the Intel-TSMC 3-D 'race'
Dylan McGrath, EETimes
7/11/2011 1:29 AM EDT
What's not to love about a story that pits semiconductor process technology leaders Intel Corp. and Taiwan Semiconductor Manufacturing Co. (TSMC) against one another in a race to achieve some high-level technical goal?
Last week, a report by the Taiwan External Trade Development Council (TAITRA), a nonprofit organization promoting trade with Taiwanese firms, did just that, issuing a report that tantalizingly suggested that TSMC might beat Intel to the punch in bringing "three-dimensional chips" to market. EE Times and other news organizations quickly seized on the report and published stories based on it.
The problem, as many EE Times readers promptly pointed out, is that the report was deeply flawed and based upon a false equivalency.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors
- Xilinx Demonstrates Industry's First Scalable 3-D Graphics Hardware Accelerator for Automotive Applications
- Xilinx And Pixel Velocity Team To Deliver World's Most Advanced 3-D Recognition Technology
- Xilinx Virtex-II Pro FPGAs Enable Pandora's Newest 3-D Colour Cube
- STMicro won't use ARM's 3-D core in Nomadik processor
Breaking News
- RISC-V Royalty-Driven Revenue to Exceed License Revenue by 2027
- Keysom Unveils Keysom Core Explorer V1.0
- SiFive and Kinara Partner to Offer Bare Metal Access to RISC-V Vector Processors
- PQSecure Partners with Menta SAS to Demonstrate Leakage-Resistant PQC IPs on eFPGA Fabric
- VESA Releases Compliance Test Specification Model for DisplayPort Automotive Extensions Standard
Most Popular
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- PQSecure Partners with Menta SAS to Demonstrate Leakage-Resistant PQC IPs on eFPGA Fabric
- Imagination Announces E-Series: A New Era of On-Device AI and Graphics
- MIPI C-PHY v3.0 Adds New Encoding Option to Support Next Generation of Image Sensor Applications
- X-Silicon Revolutionizes AI and Graphics at the Edge with "Constellation" Software Platform