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NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Setting the record straight on the Intel-TSMC 3-D 'race'
Dylan McGrath, EETimes
7/11/2011 1:29 AM EDT
What's not to love about a story that pits semiconductor process technology leaders Intel Corp. and Taiwan Semiconductor Manufacturing Co. (TSMC) against one another in a race to achieve some high-level technical goal?
Last week, a report by the Taiwan External Trade Development Council (TAITRA), a nonprofit organization promoting trade with Taiwanese firms, did just that, issuing a report that tantalizingly suggested that TSMC might beat Intel to the punch in bringing "three-dimensional chips" to market. EE Times and other news organizations quickly seized on the report and published stories based on it.
The problem, as many EE Times readers promptly pointed out, is that the report was deeply flawed and based upon a false equivalency.
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