Alvand Technologies Announce tape-out of its compact, low-power Wireless MIMO Analog Front End in 40nm
Santa Clara, California -- August 10, 2011 -- Alvand’s Wireless MIMO AFE at the 40nm process node represents the fourth generation of this proven IP technology, which has already been implemented in 130nm, 90nm and 65nm processes across multiple foundries. Alvand’s Wireless MIMO IP has been successfully integrated into multiple IC products by manufacturers worldwide. The MIMO IP is taped-out in GLOBALFOUNDRIES and is ready to be integrated in consumer products for next generation wireless communications.
Like all Alvand products, the company’s Wireless MIMO IP is fully qualified and comes with a complete set of deliverables that enable rapid integration into SoC designs. Please visit our website to learn more about Alvand Wireless MIMO IP, or contact us for additional information.
About Alvand Technologies, Inc.
Alvand Technologies is a leading analog IC design company that specializes in high-speed, low-power, and ultra small die area data converters (ADC/DAC) and Analog Front End (AFE) for a broad range of applications, such as wireless (LTE,Wi-MAX,Wi-Fi) systems, ultrasound and mobile TV. Alvand also provides full turnkey mixed-signal ASICs based on its high performance and low power IPs. For more information visit us at www.alvandtech.com
|
Related News
- Alvand Technologies Announces Advanced Wireless MIMO Analog Front End Platform for LTE/WiMAX Application
- Faraday Selects Alvand Technologies AFE (Analog Front End) IP to Support Next Generation Wireless Applications
- Silicon Image Introduces Industry's First Silicon Implementation of 40-nm Low-Power HDMI Version 1.3 Transmitter Analog IP Core
- Synopsys and TSMC Collaborate to Develop DesignWare Foundation IP for Low-Power TSMC 40-nm eFlash Processes
- Synopsys Announces Availability of Logic Library and Embedded Memory IP for Mie Fujitsu Semiconductor 40-nm Low-Power Process
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |