Tunable SM4 (ECB, CBC, CTR, XTS, CCM, GCM) accelerator - optional SCA protection
SATA-IO to Enable Higher Speed Storage Applications with SATA Express Specification
New Specification Provides Next Generation Storage Solutions for Solid State and Hybrid Drives
Beaverton, Ore. – August 09, 2011 –The Serial ATA International Organization (SATA-IO), the industry consortium dedicated to sustaining the quality, integrity and dissemination of Serial ATA (SATA™) technology, today announced it is developing SATA Express™, a new specification that combines SATA software infrastructure with the PCI Express® (PCIe®) interface. SATA Express enables the development of new devices that utilize the PCIe interface and maintain compatibility with existing SATA applications. The technology will provide a cost-effective means to increase device interface speeds to 8Gb/s and 16Gb/s.
Solid state (SSDs) and hybrid drives are already pushing the limits of existing storage interfaces. SATA Express will provide a low-cost solution to fully utilize the performance of these devices. Storage devices not requiring the speed of SATA Express will continue to be served by existing SATA technology. The specification will define new device and motherboard connectors that will support both new SATA Express and current SATA devices.
“The SATA Express specification provides SSD and hybrid drive manufacturers the advantages of performance and scalability enabled by PCIe 3.0 – which is available now – and the ubiquity of SATA” said Mladen Luksic, SATA-IO president. “We expect the SATA Express specification to be completed by the end of 2011.”
The Complete SATA Ecosystem
SATA Express is one of several specifications from SATA-IO designed to offer low-cost, high performance storage solutions optimized for specific device segments. Since its introduction in
2001, SATA technology has penetrated 99% of the PC market and evolved to provide options for a number of applications beyond traditional hard disk storage. SATA is now implemented in a variety of applications including solid state and optical drives, embedded mobile devices, consumer electronics products and enterprise storage. Key specifications for implementing SATA technology beyond the HDD device segment include:
- mSATA™: A low-profile solution for mobile computing devices and other small form factor applications.
- SATA Universal Storage Module (USM™): An integrated SATA interface for providing portable, volume storage I/O to consumer electronics devices, as well as PC applications.
- SATA μSSD™: Also announced today, an embedded, single-chip solution that connects directly to the motherboard to enable ultra-thin form factor devices.
More information on these and other SATA specifications is available at www.sata-io.org.
About SATA-IO
Formed in September 2004, SATA-IO is the International Organization that owns and manages Serial ATA specifications as open industry standards. The organization defines and implements the Serial ATA specifications as the industry’s storage needs evolve. It is dedicated to sustaining the quality, integrity and dissemination of SATA technology by maintaining the specifications, promoting and marketing the benefits of the technology and creating future interface features and specifications that carry storage into the next decade. Additional information about the organization, its participating companies and membership is available at www.sata-io.org.
Related News
- SATA-IO Increases Interoperability Features with Revision 3.5 Specification
- High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers
- NVMe Revision 1.3 Expands Reach of Fast Storage for Enterprise, Client, and Cloud Power Users
- SATA-IO Unveils Revision 3.2 Specification
- PLDA And IP-Maker Enable High Performance Storage Devices with Integrated PCIe 3.0 Controller with NVM Express IP Core
Breaking News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
Most Popular
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |