Samsung Announces High-performance 512GB SSDs with Ultra-fast SATA Revision 3.0 Interface
SEOUL, Korea - August 11, 2011 - Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, announced today volume production of SSDs (solid state drives) that support the Serial ATA Revision 3.0 interface with data transmissions at six gigabits per second (6Gb/s). The new high-performance PM830 SSDs* are available at up to 512 gigabyte (GB) densities.
Samsung's new high-speed SSDs are ideally suited for use in high-performance OEM notebooks and tablets. Sample production of the SATA 6Gb/s 512GB SSDs began in May, with volume production initiated earlier this month. The new drives are expected to replace SATA 3Gb/s-based SSDs by year-end.
"Samsung's new line up of advanced SSDs will raise the performance bar to the next level for ultra-slim notebooks and tablets and accelerate growth of the market for high-performance SSDs," said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics. "The industry is expected to quickly embrace SATA 6Gb/s-based SSDs, which also will help increase market interest in 256GB and higher densities significantly," he added.
The SATA 6Gb/s SSD shortens system boot-up time to about 10 seconds, while its high-performance allows users to download up to five DVD video files in less than a minute.
The 512GB SSD utilizes Samsung's most advanced 20 nanometer (nm) class** 32Gigabit multi-level cell (MLC) NAND memory chip incorporating the toggle DDR interface. A proprietary NAND controller facilitates exceptional performance levels that take full advantage of the toggle DDR architecture and the SATA 6Gb/s interface. The new SSD doubles the performance of a SATA 3Gb/s drive, with sequential read speeds of 500 megabytes per second (MB/s) and sequential write speeds of 350MB/s.
The drive also features the industry's highest level of security, which uses an AES 256-bit encryption algorithm to protect personal or corporate data from unauthorized access.
Samsung's SATA 6Gb/s SSDs are available in 512GB, 256GB and 128GB densities. The new high-performance SSD line-up is targeted for use in premium OEM notebooks, and tablets.
According to market research firm IDC, the global outlook for client-side SSDs is expected to grow ten-fold from 11 million units in 2011 to 100 million units in 2015. Moreover, the use of NAND in 256GB SSDs is forecast to more than double from 19 percent of all NAND used in SSDs in 2011 to 42 percent in 2015. Further, demand for 512GB SSDs is expected to grow from a 0.3 percent portion in 2011 to eight percent in 2015, also underscoring the growing interest in higher density SSDs.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2010 consolidated sales of US$135.8 billion. Employing approximately 190,500 people in 206 offices across 68 countries, the company consists of nine independently operated business units: Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, Digital Imaging, Memory, System LSI and LCD. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, semiconductor chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.
|
Related News
- Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.
- Synopsys Delivers Industry's First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage
- Silicon Motion Introduces the SM3267 Ultra High-Performance, Cost-Effective USB 3.0 Controller
- Gennum's Snowbush IP Group Receives SATA-IO Certification Revision 3.0 at 6Gb/s
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |