Santa Clara, CA, – August 18, 2011 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Brian McDonald has been appointed as Chief Financial Officer (CFO) and Vice President of Finance. As a key member of eASIC´s executive team, McDonald will assume a strategic role in the company that involves spearheading future growth initiatives in addition to managing the company’s financial functions. McDonald will report to eASIC´s President and CEO, Ronnie Vasishta.
"I am delighted Brian has decided to join the eASIC team. His experience and understanding of the important relationships between finance and the rest of the business is extremely important as we approach the next very exciting phases of our growth," said Vasishta. "He brings a solid proven track record of success in taking companies through the stages that eASIC is now facing. He is a well-respected financial executive in the semiconductor industry and we will benefit greatly from this experience."
Brian McDonald has over 30 years of finance experience with high technology companies. Prior to joining eASIC, Brian was the Chief Financial Officer, Sr. VP of Finance and Secretary at Advanced Analogic Technologies (AATI) a public silicon valley company. Brian was instrumental in taking AATI successfully through the IPO process in 2005. Prior to AATI Brian has held senior financial positions at Monolithic Power Systems, Elantec Semiconductor, National Semiconductor, Mattson Technology, Micro Linear, and Read-Rite corporation.
"I am in awe at how the eASIC team has successfully executed and met stringent growth targets even within a very turbulent economy and has successfully acquired an impressive portfolio of tier one corporations as customers," said McDonald. "This solid base is a strong platform for the next phase of the company´s growth."
Brian holds a BS degree in Business Administration from Santa Clara University.
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com