Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
China's fabless turn to Taiwan, says survey
Peter Clarke, EETimes
9/6/2011 6:42 AM EDT
LONDON – China's fabless chip companies are turning to Taiwan to a greater degree to help them get close to the leading-edge in geometry and compete globally, according to an IC design house and fabless chip company survey conducted by EE Times-China.
Some 9.2 percent of China's fabless chip companies are producing digital ICs using 45-nm or below process technologies, according to the survey.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
- Survey: China's Fabless IC Firms Optimistic on Sales Growth
- China's EDA startup X-Epic forced to lay off staff, says report
- Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce
- New US EDA Software Ban May Affect China's Advanced IC Design, Says TrendForce
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation