Digital Media Professionals (DMP) Joins TSMC Soft IP Alliance
Tokyo, Japan – October 11th, 2011 – Digital Media Professional Inc. (DMP)(TOKYO:3652), a leading provider of 2D/3D graphics IP core, today announced that it has joined the TSMC Soft IP Alliance Program.
DMP graphics IP cores feature low-power, small footprint and high performance for embedded graphics applications in mobile, home, car, amusement and office.
“We’re pleased to join TSMC’s Soft IP Alliance Program to help accelerate our business both here and abroad,” said Tatsuo Yamamoto, President & CEO of DMP.
“Adding DMP gives our customers greater access to their products and enhances customers’ confidence in the quality of result via our IP assurance program,” said Suk Lee, TSMC Director of Design Infrastructure Marketing.
About DMP
Digital Media Professionals Inc. (DMP)(TOKYO:3652) is a world-class leader bringing 2D and 3D graphics solutions to market from Japan since its founding in 2002, and is currently developing graphics IP core based on DMP’s cutting edge 3D graphics technology DMP Maestro Technology.
For more about DMP, please visit our website: http://www.dmprof.com/english/
|
DMP Inc. Hot IP
Related News
- Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market
- Memoir Systems Joins TSMC Soft IP Alliance
- Arteris Joins TSMC Soft IP Alliance
- Chips&Media Joins TSMC's Soft-IP Alliance Program
- Sonics Joins TSMC's Soft IP Alliance Program
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |