CEVA and Mindspeed to Demonstrate Real-World LTE Small Cell Base Station Technology at 4G World

Companies to Feature Low-Power System-on-Chip (SoC) for Long-Term Evolution (LTE) Picocells and Enterprise Femtocells using Trillium LTE Protocol Stacks

NEWPORT BEACH, Calif. -- Oct 24, 2011 -- Mindspeed Technologies, Inc., a leading supplier of semiconductor solutions for network infrastructure applications, and CEVA, Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and digital signal processors (DSP) cores, today announced that the companies will showcase LTE base station advances based on Mindspeed's Transcede(R) SoC using Trillium LTE Protocol Stacks at 4G World from October 25 -27, 2011 at McCormick Place in Chicago, IL. The companies will demonstrate the only commercially-available eNodeB picocell reference design based on a single SoC. The design utilizes Mindspeed's carrier-class L1 PHY software and production-grade Transcede SoC enabled by CEVA's DSP technology.

Attendees visiting CEVA's booth (#1424) at the show can see a real-world small cell LTE base station transmitting high-definition (HD) video to a commercially available LTE smartphone. The demonstration is built around Mindspeed's LTE small cell reference unit and award-winning Transcede SoC that includes 26 programmable processors, including 10 CEVA DSPs and 10 DSP accelerators and two ARM(R) Cortex A9(R) multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors.

"Small cell base station designs require unparalleled processing capabilities to cope with the huge performance demands of LTE networks, and our communication DSPs play a critical role in achieving this," said Eran Briman, vice president of marketing at CEVA. "This real world LTE base station demonstration using commercially available LTE smartphones clearly illustrates the outstanding performance capabilities of the Transcede family of processors, powered by our industry-leading DSP cores."

Mindspeed(R)'s Transcede processor is the first fully-integrated SoC eNodeB solution offering 3GPP LTE Layer 1, Layer 2 and Layer 3 processing with picocell performance. It enables original equipment manufacturers (OEMs) to leverage the same software architecture and programming model across the entire family of Transcede processors, and to scale designs from enterprise femtocells and picocells to microcells and other evolutionary form factors.

CEVA DSPs form the basis for a broad range of solutions for wireless base station applications, spanning from femtocells to macrocells. Bringing the highest flexibility and performance to base station architectures, CEVA DSPs are backed up by associated reference architectures, a complete development environment and a comprehensive suite of optimized library functions, including LTE, LTE-A, WiMAX and HSPA+.

Radisys, a leading provider of embedded wireless infrastructure solutions, will provide its Trillium LTE eNodeB software that is integrated off-the-shelf with the Mindspeed Transcede SoC processors to support the demonstration. The Trillium LTE wireless protocol software meets the unique requirements of network equipment providers with its comprehensive standard compliant protocol suite designed for portability and scalability that stretches from all variations of small cells up to macro cells.

"Mindspeed pioneered the concept of single-chip SoCs for LTE small cells and chose CEVA as the primary DSP processor for its Transcede family of processors in order to deliver a solution that exceeds the market demand for advanced processing performance, design flexibility and optimal power consumption," said Alan Taylor, director of marketing for the communications convergence processing business unit at Mindspeed. "Collaborating with CEVA has allowed us to address the demand for small cells with a fully-integrated solution that packages Mindspeed's carrier-grade software with significant, multi-layer processing power and hardware acceleration on a single SoC."

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for wireless communications, multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com .

About Mindspeed Technologies

Mindspeed Technologies MSPD +0.20% is a leading provider of network infrastructure semiconductor solutions for the communications industry. The company's low-power system-on-chip (SoC) products are helping to drive video, voice and data applications to in worldwide fiber-optic networks and enable advanced processing for 3G and 4G-LTE mobile networks. The company's high-performance analog products are used in a variety of optical, enterprise, industrial and video transport systems. Mindspeed's products are sold to original equipment manufacturers (OEMs) around the globe. To learn more, please visit www.mindspeed.com .