TSMC's R&D chief sees 10 years of scaling

DylanMcGrath, EETimes
10/25/2011 2:45 PM EDT

SANTA CLARA, Calif.—The path is clear for continued semiconductor scaling using FinFETs for the next decade, down to the 7-nm node, according to Shang-Yi Chiang, senior vice president of R&D at foundry giant Taiwan Semiconductor Manufacturing Co.

Beyond 7-nm, the most pressing challenges to continued scaling will come from economics, not technology, Chiang said in a keynote address at the ARM TechCon event here Tuesday (Oct. 25).