USB 3.2 Gen2x2 with PIPE 4.3 and USB2.0 with UTMI+ interface
In search of new chip startup funding models
Dylan McGrath, EETimes
12/6/2011 8:09 PM EST
We've heard it so many times, by now it sounds like a broken record: venture capitalists, long the lifeblood nurturing a thriving community of semiconductor startups, have all but abandoned the chip industry, turning instead to social media and green energy technologies, where the common wisdom is a smaller investment can go a lot further.
We've heard many times, too, that its hard to blame them. The fact of the matter is that bringing a chip to market, even for a fabless company, has become an ultra-expensive proposition requiring on the order of $30 million or more. And we've also heard plenty about what a dangerous situation this is for the semiconductor industry, which has practically since it began depended on the innovation brought by small start ups to thrive.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Israeli AI startup NeuReality raises $35M Series A to bring its novel inferencing chip to the market
- Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round
- SambaNova Systems Raises $676M in Series D, Surpasses $5B Valuation and Becomes World's Best-Funded AI Startup
- Israeli AI Chip Startup Raises Seed Funding
- EDA Start-Up Intento Design Raises 900k Euros in Early Stage Funding
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration