Rambus Settles Stockholder Suit Related to Past Stock Option Backdating
SUNNYVALE, Calif.--December 21, 2011-- Rambus Inc. (NASDAQ: RMBS), one of the world's premier technology licensing companies, today announced it has agreed to settle one of the two remaining stock option related lawsuits. The settlement will resolve the matter captioned Stuart J. Steele, et al. v. Rambus Inc., et al., originally filed in 2008, related to stock option grants that were not correctly dated or accounted for prior to 2006, with the vast majority of incorrectly dated grants occurring between 1998 and 2001. The case was scheduled to go to trial in March 2012, and Rambus has agreed to settle the claims against it and the individual defendants for $10.85 million.
About Rambus Inc.
Founded in 1990, Rambus is one of the world's premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Its breakthrough innovations and solutions help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.
|
Related News
- Rambus Provides Update Regarding Independent Review of Past Stock Option Practices
- Rambus Provides Update Regarding Independent Stock Option Review
- Rambus Expects Financial Restatement Related to Stock-Based Compensation
- Rambus Provides Update of Audit Committee Investigation Regarding Stock Option Grants
- Rambus Announces New Stock Repurchase Program
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |