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InComm SoC platform supports various CPU cores
By Mike Pan, EE Times
April 3, 2002 (3:25 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020403S0017
TAIPEI, Taiwan—InComm Technologies Co. Ltd., a Taiwan-based system-on-chip services provider, has introduced a platform dubbed InPlat to accelerate the SoC design process. "The platform is specially designed for applications such as communications and multimedia," said InComm president Tony Lo.
Lo said that unlike other SoC platforms, InPlat supports CPU cores from different vendors such as ARM Ltd. and Tensilica Inc. Thus, taking a processor's functionality and cost into account, a customer can choose a suitable CPU for its target product. Apart from the CPU, the platform includes other intellectual-property cores such as USB and UART.
Half the time
"The integration of design-and-verification flow and FPGA design flow enables InPlat to shorten our customers' design process," said Lo, who estimated that InPlat could essentially halve the time taken by a conventional design flow.
InComm said it has also si gned an agreement with Adamya Technologies Inc., a specialist in delivering wireless solutions on a chip. Under terms of the deal, InComm can use Adamya's Bluetooth software baseband technology.
Mike Pan is bureau chief of sister publication EE Times-Taiwan.