SLC NAND Offerings Support Requirements for Built-in ECC
IRVINE, Calif., Jan. 5, 2012 -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the development of BENAND™, a versatile, multi-application single level cell (SLC) NAND flash memory with embedded error correction code (ECC). The simple interface and high reliability of small capacity SLC NAND has enabled it to be widely used in consumer applications and industrial programming. Samples of eight BENAND products in two capacities, 4Gb and 8Gb, are now available, with mass production beginning March 2012.
BENAND's diverse applications include LCD TVs, digital cameras, robots and other industrial applications that include 2-way radios, thermostats, home gateways, cable boxes, POS systems, smart meters, vending machines, in-flight entertainment systems and LCD advertising systems. BENAND removes the burden of ECC from the host processor while minimizing protocol changes and allowing host processors to support leading-edge process NAND flash memory in a timely manner. Package and pin configuration compatibility are assured with general SLC NAND flash, allowing for easy replacement in existing products.
Until now, the ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction.
"Toshiba's BENAND enables smooth migration to the latest SLC NAND process technologies," noted Brian Kumagai, senior business development manager, NAND flash memory products for TAEC. "With its on-board ECC, BENAND provides rapid migration to higher density SLC NAND for long life-cycle applications such as industrial and OEM."
SLC-based BENAND joins Toshiba's family of embedded NAND solutions, the SmartNAND family, which integrates leading-edge 24nm process MLC NAND flash technology with a control chip that supports ECC and is available in densities ranging from 4 to 64 gigabytes (GB). BENAND is currently available in 4 gigabits (Gb) and 8Gb TSOP and BGA packages.
Looking to offer customers more choices and further its advances in memory products, Toshiba plans to expand the BENAND lineup to include 24nm process NAND flash memory products in Q2 2012.
 BENAND is a trademark of Toshiba Corporation.
|Product Number ||Capacity ||I/O ||Voltage ||Package ||Mass production |
|TC58BVG2S0FTA00 ||4Gbit ||x8 ||2.7 to 3.6 ||48pin TSOP ||March 2012|
|TC58BYG2S0FTA00 ||1.7 to 1.95 ||48pin TSOP|
|TC58BVG2S0FBAI4 ||2.7 to 3.6 ||63ball FBGA|
|TC58BYG2S0FBAI4 ||1.7 to 1.95 ||63ball FBGA|
|TC58BVG2S5FBAI4 ||x16 ||2.7 to 3.6 ||63ball FBGA|
|TC58BYG2S5FBAI4 ||1.7 to 1.95 ||63ball FBGA|
|TH58BVG3S0FTA00 ||8Gbit ||x8 ||2.7 to 3.6 ||48pin TSOP ||2Q / 2012|
|TH58BYG3S0FTA00 ||1.7 to 1.95 ||48pin TSOP|
- 4 bit per 512 bytes ECC and 32nm process NAND flash memory are embedded in one package.
- Embedded versatile interface. Package and pin configuration compatibility are ensured with general SLC NAND flash, allowing easy replacement of existing products.
- Allows the host processor to apply cutting-edge process NAND flash memory regardless of the error correction ability of the host processor by embedding ECC in the NAND flash memory itself.
|Interface ||General NAND flash memory interface|
|Page Size ||4K Byte|
|Package ||・48 pin TSOP（12mm x 20mm x 1.2mm） |
・63 ball FBGA (9mm x 11mm x 1.0mm)
About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, LCD displays, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, April 2011). Toshiba was founded in 1875 and today has over 490 subsidiaries and affiliates, with 203,000 employees worldwide and annual sales of $77 billion. Visit Toshiba's web site at www.toshiba.co.jp/index.htm
For additional company and product information, please visit http://www.toshiba.com/taec/.