Moortec Semiconductor Demonstrates Temperature Sensor IP on Low-Geometry Technologies
Plymouth, UK -- January 16, 2012 -- Moortec Semiconductor Limited, provider of mixed-signal IP and chip solutions, has demonstrated its high-performance analog IP on TSMC's 40LP and 28HP processes. Shown in silicon, the Moortec Embedded Temperature Sensor (METS) IP range is a complex, high-precision analog design targeting thermal monitoring and management applications in advanced-geometry digital ICs. The temperature sensor has been designed using standard CMOS logic processes for 40-nanometer (nm) and 28-nm geometries and can be easily instantiated multiple times across a System-on-Chip (SoC) for die temperature profiling. Although an analog IP, its digital interfacing means it is easy to integrate within any digital implementation flow.
"With shrinking silicon geometries, there is a growing need for on-chip temperature monitoring for performance optimisation and device characterisation," said Stephen Crosher, Managing Director of Moortec Semiconductor. “At these process nodes designers have to deal with issues of process variability and thermal effects. The METS IP range, now demonstrated in silicon, allows designers to monitor die temperature for Dynamic Voltage and Frequency Scaling (DVFS) purposes or for device characterisation during the burn-in test phase.”
Moortec, who have already delivered the IP to several major customers, plan to increase its availability by porting the temperature sensor to other process nodes including TSMC 28HPM and Global Foundries GF28SLP. The company then intends to take advantage of its position in the die monitoring space by developing IP modules capable of ascertaining die process type, monitoring temperature and varying supply voltage, which will target further DVFS applications.
See www.moortec.com for more information on the METS IP range.
About Moortec Semiconductor
Moortec Semiconductor, established in 2005, provide high quality analog and mixed-signal IP blocks as well as Custom Chip solutions world-wide for a variety of applications. The UK based design group also provide Platforms for IC test and evaluation. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations. For information please visit www.moortec.com.
|
Related News
- Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
- Moortec Semiconductor Target Stacked DRAM Applications with its High Accuracy On-Chip Temperature Sensor
- Moortec Semiconductor Announces Industry Leading, High Accuracy On-Chip Temperature Sensor Range for Advanced Nodes
- Achronix Selects Moortec's 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
- MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |