Analyst warns of chip downturn in 2013
Dylan McGrath,EETimes
1/17/2012 10:27 PM EST
HALF MOON BAY, Calif.—The semiconductor industry is expected to grow by 6 to 7 percent this year, but will contract in 2013 as the U.S. economy slows, according to Handel Jones, founder and CEO of International Business Strategies Inc. (IBS).
Speaking at fab tool vendor trade group SEMI's annual Industry Strategy Symposium here Tuesday (Jan. 17), Jones said IBS expects memory sales to grow by 11 percent this year as pricing improves and non-memory chips to see 6 percent growth in 2012.
E-mail This Article | Printer-Friendly Page |
Related News
- DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce
- Foundries defy chip market downturn
- DRAM Market Deflates, Cyclical Downturn Looms
- Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks
- DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024