SANTA CLARA, Calif.--January 30, 2012--eASIC Corporation, a provider of NEW ASIC devices, today announced 80% growth in sales revenue from calendar year 2010 to 2011. The majority of the revenue in 2011 was split between wireless infrastructure and storage markets. However, other applications also contributed to the revenue. At the end of 2011, eASIC had completed 170 tape-outs and had delivered 167 prototypes. In addition, 66% of the revenue was derived from shipping new products, namely, 45nm Nextreme-2 NEW ASIC production.
“eASIC’s low-NRE, fast-turn NEW ASIC devices are being used in a wide range of applications including 3G and 4G wireless base stations, wireless and optical backhaul, cloud computing with enterprise solid state storage, consumer hybrid SSD drives and medical ultrasound consoles,” said Jasbinder Bhoot, eASIC VP Marketing. “OEMs have been able to significantly reduce their total-cost-of-ownership by rapidly migrating to eASIC devices for volume production and hence limiting the use of expensive FPGAs to prototyping only. eASIC’s ability to also rapidly deliver low-cost, production devices at a fraction of the cost of cell-based ASIC, is enabling consumer electronics OEMs to fearlessly venture into new untapped markets, with significantly lower cost and lower risk.”
“2011 has been a phenomenal year of growth for eASIC,” commented Ronnie Vasishta, eASIC President and CEO. “Unlike much of the semiconductor industry which saw a revenue decline in wireless infrastructure, we were able to grow substantially and expand our customer base. What’s particularly exciting for us is our growing portfolio of Tier-one OEM customers, as this is a strong testament that our core value proposition of affordable mass customization is hitting resonance.”
To learn more about eASIC’s Nextreme-2 NEW ASICs and easicopy cell-based ASIC products, visit www.easic.com.
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com.