English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
UMC to boost 2012 capex to $2 billion
Dylan McGrath, EETimes
2/8/2012 9:04 PM EST
SAN FRANCISCO—Taiwanese semiconductor foundry United Microelectronics Corp. (UMC) said Wednesday (Feb. 8) it plans to spend about $2 billion on capital expenditures in 2012, up 25 percent from the roughly $1.6 billion it spent on capital expenditures in 2011.
UMC (Hsinchu, Taiwan) said 97 percent of its 2012 capital spending would go toward 300-mm capacity expansion.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Semi Industry Capex Forecast to Jump 24% and Reach Over $190 Billion This Year
- Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion
- GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology
- UMC Expects AI to Grow to $3 Billion Business
- TSMC Boosts 2016 Capex to About $9.5 Billion
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation