Dirac HD Sound® technology leverages 32-bit processing capabilities of CEVA market-leading audio DSP; Technology to be demonstrated at Mobile World Congress 2012
MOUNTAIN VIEW, Calif., Feb. 15, 2012 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores and Dirac Research AB, a specialist in high-end audio technology, announced today that the companies have partnered to deliver advanced speaker correction capabilities for the 32-bit CEVA-TeakLite-III DSP targeting mobile, home and automotive applications. These Dirac technologies extend CEVA's leadership in low-power, high-performance, audio platforms and this solution is already in use by a top-tier audio chip vendor.
The Dirac HD Sound solution is a mixed-phase speaker correction technology that optimizes a sound system's transient reproduction for optimal performance and clarity. This software offering has now been fully optimized for the native 32-bit processing capabilities of the CEVA-TeakLite-III architecture, ensuring a cost-efficient low power and low system overhead solution, even within constrained systems. The two companies will demonstrate the combined solution at the upcoming Mobile World Congress in Barcelona, Feb 27- March 1, 2012, in CEVA's booth (Hall 1, Stand 1F 33).
"CEVA is recognized for its advanced 32-bit audio DSPs, with numerous production design wins and broad market adoption. Their audio-tuned architecture and advanced instruction set provide a cost-effective and high-quality platform on which to implement the Dirac HD Sound technology. Using CEVA's comprehensive software development tools and their excellent support, we were able to produce and demonstrate a fully optimized version of Dirac HD Sound in a matter of days," said Mathias Johansson, CEO at Dirac.
"We are pleased to add Dirac's premium quality audio post-processing capability to the ecosystem of our CEVA-TeakLite-III DSP, supporting more than 90 voice and audio codecs and pre/post-processing functions," said Eran Briman, vice president of marketing at CEVA, "Dirac's approach enables a high quality post-processing solution for developers of audio ICs in an easy to deploy, cost-efficient manner."
The Dirac HD Sound technology has been proven across a range of high-end audio applications in the consumer, cinema, professional and automotive markets. The technology enhances many audio and voice aspects, including voice correction, stereo image correction, bass correction, listening fatigue minimization, and tonal and transient correction.
The CEVA-TeakLite-III is a native 32-bit, high performance audio DSP core, used in mobile application processors, audio CODEC chips, baseband processor chips and home entertainment main SoCs , to handle, among other tasks, advanced audio scenarios, such as multi-stream audio playback with various post-processing functions for enhanced audio experience. The DSP-based solution includes a configurable cached memory subsystem, a comprehensive set of optimized HD audio codecs, and complete software development kit, including software development tools, prototype boards, test chips, system drivers and RTOS.
About Dirac Research:
Founded in 2001, Dirac Research is a premier R&D company specializing in high-performance digital sound optimization, room correction and sound field synthesis. The company was founded by researchers from the Signals & Systems Group of Uppsala University, Sweden, which has fostered 8 Nobel Prize laureates. With Dirac's patented toolbox for efficient and accurate audio system optimization, customers such as BMW, Bentley, Rolls Royce and Datasat Digital Entertainment have achieved dramatically improved sound quality and a shortened time-to-market. Dirac Research maintains offices in Sweden, Tokyo, Detroit, San Diego, Seoul and Shanghai. www.dirac.se.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.