Samsung positions its fab to take on TSMC

EETimes, 2/21/2012 8:03 PM EST

SAN FRANCISCO--Samsung touted its new 32-nm high-k metal gate (HKMG) process at the International Solid-State Circuits Conference here Tuesday (Feb. 21), showing features it hopes might win customers over from a supply constrained TSMC.

While ostensibly presenting its upcoming 32-nm quad-core mobile processor, Samsung spent much of the time presenting its new process, which as well as boasting HKMG, also uses dynamic thermal management and body bias techniques, for a significant 40 percent performance increase over its 45-nm Exynos chip.

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