Chips&Media shows Next Generation of Video Processing Technologies at MWC 2012
Experience Chips&Media’s Next generation 4K video solution at MWC2012
Seoul, Korea. –February23, 2012 – Chips&Media,Inc., a leading company in silicon video Intellectual Property (IP), today announces that it will demonstrate the latest video technologies at the Mobile World Congress 2012 in Barcelona, Spain from February 27th through March 1nd.
Chips&Media's demonstrations will be shown, including:
- The FPGA-based demonstration of decoding MVC
- The FPGA-based demonstration of decoding UHD(4 times larger than 1080p) content
- A large number of OEM partner devices integrated with Chips&Media's proven technology, such as Smartphone, Tablet PC, Digital Photo Frame, and Portable Media Players.
Chips&Media will be located at stand F07, Korea Pavilion in Hall 1. To request a meeting with Chips&Media at Mobile World Congress 2012, please simply email pr@chipsnmedia.com.
About Chips&Media
Chips&Media,Inc. is a leading video IP provider based in Seoul, Korea(Republic of). Its advanced ultra-low power and high performance video technology has been chosen by more than 50 top-tiers based in US, Europe, Korea, Taiwan, China and Japan and has proven in silicon reaching 80 millions of units. For more information, please visit the company’s web site at www.chipsnmedia.com
|
Chips&Media Hot IP
Related News
- Chips&Media to Exhibit its latest Video IP at CES 2012
- Chips&Media to Demonstrate High-definition Video Encoding Technology at MWC 2009
- Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+
- Silicon IP Provider Chips&Media Launches AV1 Video Encoder Hardware IP for 4K/UHD Video Resolutions and Beyond
- A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021
Breaking News
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Quobly announces key milestone for fault-tolerant quantum computing
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Most Popular
- SiFive Empowers AI at Scale with RISC-V Innovation
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
- Alphawave IP - Announcement regarding leadership transition
- Now Gelsinger is gone, what is Intel's Plan B?
- Sondrel now shipping chips as part of a complete turnkey project
E-mail This Article | Printer-Friendly Page |