Test Chip Achieves 900MHz Performance
SHANGHAI and CAMBRIDGE, United Kingdom, Feb. 27, 2012 -- Brite Semiconductor (Shanghai) Corporation, a leading IC design and turnkey service provider, Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK), and ARM today jointly announced the first tape out of a dual-core ARM® Cortex™-A9 MPCore™ test chip using SMIC's 40nm low leakage process technology.
The test chip is an implementation of a dual-core Cortex-A9 processor designed using SMIC's 40nm low leakage process technology. The processor incorporates a 32K I-Cache and 32K D-Cache, 128 TLB entries, NEON™ technology, as well as debug and trace technology from the CoreSight™ Design Kit. In addition to high-speed standard cell libraries, high-speed customized memories and cells were adopted in the test chip to enhance performance. The test chip was signed off at 900MHz (WC), with typical silicon results expected to top 1.0GHz when the results become available in Q2 2012.
"The dual-core chip is designed using SMIC's 40nm low leakage process, which minimizes the time, risks and costs associated with bringing a high-performance Cortex-A9 processor implementation to market. We are delighted that the development work with ARM and SMIC on processor cores and implementation optimization has resulted in this test chip tape out, which demonstrates the close partnership between the three companies. With the support of ARM and SMIC, Brite brings huge value to customers who need high-performance ARM cores," said Dr. Charlie Zhi, President & CEO of Brite Semiconductor.
"Working closely with ARM and Brite allows us to deliver an integrated platform that rapidly brings customers' designs to production. We value the partnership with Brite and ARM, and the work they accomplished to achieve this milestone. It is a strong testimonial of our mutual commitment to provide industry-leading technology for advanced-node designs. The combination of SMIC's 40nm technology, the ARM Cortex-A9 processor and Brite's design flow will help meet the increasing demand for high-performance and energy-efficient consumer devices," said Chris Chi, Chief Business Officer of SMIC.
"ARM continues to work with partners in China to develop an ecosystem that drives innovation and growth," said Allen Wu, President, ARM China. "This important milestone with Brite and SMIC is a great example of what our partnership can achieve and promises faster time to market for a broad range of high performance and low power devices."
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM's comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company's broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.
Brite Semiconductor is a fabless ASIC turnkey service company delivering the most cost-effective, predictable and reliable custom ASIC solutions to electronics product customers worldwide. With SMIC and Open-Silicon as strategic partners, Brite Semiconductor uses proven design flows and methodologies with advanced design capabilities and provides end-to-end custom ASIC solutions, based on a proven business model that provides a seamless, low-cost, low-risk alternative to traditional models for complex ASIC design and development. For more information, please visit www.britesemi.com.
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.
For more information, please visit http://www.smics.com.