SMIC Raises First Quarter 2012 Revenue and Gross Margin Guidance
SHANGHAI, April 9, 2012 -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the world's leading semiconductor foundries, is pleased to announce today an upward revision of its first quarter revenue and gross margin guidance for the three months ended March 31, 2012, which was originally released by SMIC in its results for the three months ended December 31, 2011 on February 8, 2012 (the "Original Guidance").
"Since the release of our original guidance, we have seen solid order momentum and an improved outlook from our customers across the board, exceeding our earlier expectations. Therefore, we are now raising our first quarter 2012 revenue guidance to a sequential increase of 14% to 15%, from the original guidance of an increase of 7% to 9%. We are also raising our first quarter 2012 gross margin guidance to between 10% and 12% from the original guidance of between 4% and 7%, as a result of the increased loading in our fabs," said Gary Tseng, Chief Financial Officer of SMIC.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab under construction in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit www.smics.com
|
SMIC Hot IP
Related News
Breaking News
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
- Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
- NVMe Updates Expand Discoverability, Security
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
Most Popular
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- NVMe Updates Expand Discoverability, Security
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
E-mail This Article | Printer-Friendly Page |