Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
TOKYO, Japan - April 17, 2012 - Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital broadcasting receivers.
"Renesas is a premier provider of advanced semiconductor solutions and has proven experience in developing products for digital broadcasting receivers. We are proud they have selected our popular ConnX BBE16 DSP core after an extensive evaluation," stated Eric Dewannain, Tensilica's vice president and general manager, Baseband Business Unit. "The ConnX BBE16 DSP is a high-performance, and very efficient, 16-MAC (multiply accumulate) DSP that is ideal for use in products such as home wireless networks, multi-standard broadcast receivers, and digital television demodulators."
More information about the ConnX BBE16 DSP can be found at http://www.tensilica.com/products/dsps/connx-baseband-engine.htm
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Bwave and Ubiso to Demonstrate World's First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica's ConnX BBE16 DSP
- Tensilica HiFi Audio/Voice DSP Licensed to Renesas Electronics
- ClariPhy Licenses Tensilica's Xtensa Dataplane Processor (DPU) for Optical Networking Mixed Signal, Digital Signal Processing (MXSP) SOCs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |