USB 2.0 femtoPHY in TSMC (40nm, 28nm, 22nm, 16nm, 12nm, 10nm, 7nm, 6nm)
Tensilica Adds Support for Dynamic Resolution Adaptation Audio Standard to HiFi Audio DSP Library
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
All HiFi Products Now Support the DRA Standard, Which is China's Approved National Audio Standard
Santa Clara, CA USA - April 23, 2012 - Tensilica, Inc. today announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its library of over 100 audio encoders, decoders and sound enhancement packages for its popular HiFi Audio DSP (digital signal processor) family. Now all products that include the HiFi Audio DSPs can be used to support the standard approved by the People's Republic of China as the National Audio Standard (GB/T 22726-2008) for multi-channel audio decoding. Tensilica has delivered the HiFi DRA decoder to a number of Tier 1 system OEMs and semiconductor companies.
"DRA is an approved optional audio codec standard for Blu-ray Disc audio, adopted as an audio codec for the Chinese Multimedia Mobile Broadcast (CMMB) standard," stated Larry Przywara, senior director of multimedia marketing. "It is an important audio standard for terrestrial digital TV, IPTV, internet streaming, and Blu-ray Disc applications in China."
Tensilica's HiFi Audio DSPs are the leading licensable audio DSP IP cores, licensed by over 45 customers including five of the top 10 semiconductor manufacturers and many leading system OEMs. The HiFi Audio DSPs support over 100 audio and voice codecs with very efficient processing at low power. The HiFi Audio DSPs are part of Tensilica's growing line of dataplane processors (DPUs) that efficiently do the challenging, compute-intensive tasks in system on chip (SOC) designs.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Synopsys DesignWare ARC Sound IP Solution First to Support the Dynamic Resolution Adaptation Audio Standard
- Tensilica Adds RealAudio Decoder Support for HiFi 2 Audio DSPs
- Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
- DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs
- Cadence Tensilica HiFi DSPs Now Support Dynamic Speaker Management Software from Maxim Integrated
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |