Time for a return to the customer-backed joint venture foundry?
Peter Clarke, EETimes
4/20/2012 11:05 AM EDT
Qualcomm and some other companies are leaving money on the table because they can't get enough 28-nm chips to meet demand out of foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. Horror of horrors some customers are looking for ways to switch other companies' chips into slots previously designed around those vendors' ICs.
Could this be one of the ways Intel gets a leg up in the smartphone and tablet computer markets? Whether or not that happens to any significant degree, the current undersupply situation looks set to trigger refinements to some business models.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
- Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
- Imagination Technologies and BAIC Capital announce automotive joint venture
- Is It Time to Forget about Huawei?
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation