MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
TSMC raises capex to record $8.5 billion, pulls in 20-nm
Peter Clarke, EETimes
(4/26/2012 12:23 PM EDT)
LONDON – Taiwan Semiconductor Manufacturing Co. Ltd. has raised its planned capital expenditure for 2012 to between $8 billion and $8.5 billion. The move accompanied the announcement of first quarter financial results and strong second quarter outlook by the foundry.
TSMC (Hsinchu, Taiwan) said that it needed to increase capex because of stronger than expected demand for 28-nm wafers and because it has decided to "pull in" the creation of a 20-nm R&D process line.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024