Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
3D Graphics on Xilinx ZC702 Board
May 2, 2012 -- Croatia – Xylon has ported company's 3D Graphics Processing Unit (GPU) from the in-house designed evaluation hardware to the Xilinx ZC702 Evaluation Board for Xilinx® Zynq™-7000 Extensible Processing Platform (EPP).
3D graphics demos rendered by Xylon's logi3D Scalable 3D Graphics Accelerator IP core running on the Xilinx® ZC702 Evaluation Board. The logi3D is designed to support the OpenGL® ES 1.1 API and run on the Xilinx Zynq™-7000 EPP. Due to its ARM® AMBA® AXI4 compliance, the logi3D IP core can also be used with the Xilinx 7 Series and other FPGA families.
|
Xylon Hot IP
Related News
- Xylon Unveils 2D and 3D Graphics/HMI logicBRICKS Reference Designs for Xilinx Zynq-7000 ZC702 Evaluation Board
- Xylon Releases the Reference logicBRICKS Graphics Processing Unit (GPU) Design for Xilinx Zynq-7000 AP SoC based inrevium Extension Microcontroller Card from Tokyo Electron Device, Ltd.
- Xylon Showcases the World's Fastest 3D Graphics Engine for Xilinx Zynq-7000 All Programmable SoC
- Xylon's 3D graphics accelerator IP core targets the Xilinx Zynq-7000 Extensible Processor Platform (EPP) family
- Xilinx Demonstrates Industry's First Scalable 3-D Graphics Hardware Accelerator for Automotive Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |