LSI Logic is first to announce 266MHz ARM926EJ-S core available in 0.11-micron ASIC library
MILPITAS, Calif., April 16, 2002 - Continuing its leadership in high performance system-on-a-chip (SoC) ASIC designs, LSI Logic Corporation today announced the industry's first implementation of the ARM® Jazelle™ technology-enabled ARM926EJ-S™ microprocessor core in a 0.11 micron ASIC technology for customer SoC designs. The ARM926EJ-S core is now available in LSI Logic's high performance Gflx™ 0.11 micron (drawn) process technology running at 266 MHz at worst case conditions. This new high performance core extends LSI Logic's CoreWare® portfolio to address the increasing number of computation-intensive communications, storage, and consumer applications requiring Java capability and complex operating systems such as Linux. The ARM926EJ-S core is also available in LSI Logic's G12™ 0.18-micron (drawn) technology running at 200 MHz. LSI Logic has already engaged with a number of key customers on ARM926EJ-S core-based designs.
"We are very pleased with the performance achieved by this latest core from ARM," said Rafi Kedem, senior director of the processor cores technology group at LSI Logic. "Not only does the ARM926EJ-S core add significant features such as hardware Java acceleration, and a memory management unit (MMU) for complex operating systems, but it offers even higher performance than earlier ARM9E™ family cores. We are seeing a lot of customer interest in this new core."
LSI Logic was the first ARM silicon partner to reach 200 MHz on the popular ARM946E-S™ core on 0.18um and was one of ARM's lead partners for the ARM926EJ-S core. LSI Logic's portfolio includes the ARM7TDMI-S™ core, the ARM946E-S core, the ARM966E-S™ core, and the ARM926EJ-S core as well as a broad range of processor peripherals, a complete family of processor subsystem reference designs, and processor based platforms for customers' SoC design needs. LSI Logic also provides 'rapid prototyping' support as well as worldwide processor integration support. For over two years LSI Logic has standardized on the ARM AMBA® on-chip interconnect as its SoC connectivity standard for all processor related intellectual property (IP) functions. More recently LSI Logic was one of the first ASIC vendors to offer full support for the new Multi-Layer AMBA on-chip interconnect standard from ARM. LSI Logic has also licensed the entire portfolio of complex functionality ARM PrimeCell® peripherals to further enhance the range of IP cores available to its SoC ASIC customers.
"Once again, LSI Logic has used its exceptional SoC ASIC capabilities to quickly offer customers a high-performance, customer-ready ASIC implementation of one of our leading-edge processor cores," said Steve Evans, VP, Segment Marketing, ARM. "We're very pleased to see LSI Logic's strong ongoing commitment to ARM's IP portfolio, and their particular emphasis on very high-performance ASIC processor cores and subsystems."
For additional information on LSI Logic's family of ARM processor cores, please visit: http://www.lsilogic.com/products/microprocessors/index.html
About LSI Logic Corporation
LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1551 McCarthy Boulevard, Milpitas, CA 95035, 866-574-5741 (within U.S.), 408-954-3108 (outside U.S.), http://www.lsilogic.com.Related News
- LSI Logic extends leadership in high-speed serial interconnect with two GigaBlaze 0.11-micron multi-gigabit transceiver cores
- Chartered Launches 0.13-Micron, 0.11-Micron and 90-Nanometer Processes at 300-mm Fab
- LSI Logic Licenses Synthesizable ARM926EJ-S Core With a Memory Management Unit and Java Support
- Key ASIC Completes Optimized ARM926EJ-S Processor for Consumer Applications
- Faraday Implements Ultra Small ARM926EJ-S Hard Core in UMC 0.13um Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |