NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Siemens licenses Motorola's 3G handset platform
![]() |
Siemens licenses Motorola's 3G handset platform
By Patrick Mannion, EE Times
April 16, 2002 (1:45 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020415S0060
MANHASSET, N.Y. Siemens said it will use Motorola Inc.'s i.300 Innovative Convergence 3G platform for a line of Universal Mobile Telecommunications System (UMTS) terminals it plans to ship starting early 2004. Siemens is the first major company to license the i.300 platform, and Motorola said the deal validates the technology licensing model it initiated last year. Motorola had previously licensed only its 2.5G platform, and only in Asia to such companies as Eastcom and Benq. "This is a very significant win for us," said Pete Shinyeda, vice president and general manager of the wireless and broadband systems group within Motorola's Semiconductor Products Sector. "Last summer we announced we were taking our technology to the commercial merchant market. This is our first tier-one win for this strategy, so it validates our proposition. It's also a 3G first for us." The deal also strengthens Motorola's and Siemens' interoperability test ing capabilities, said Shinyeda. The drive for better interoperability testing comes in the wake of what Motorola sees as the WAP debacle. Under terms of the contract, Motorola's semiconductor sector will provide Siemens with a complete chip solution, including an RF front-end, baseband processor and applications processor, with the latter unit based on the company's DragonBall MX microprocessor series.
Related News
- Siemens' Calibre platform now certified for IFS' Intel 16 process technology
- MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor
- Siemens' Calibre platform expands early design verification solutions
- Siemens' state-of-the-art Symphony Pro platform expands mixed signal IC verification capabilities
- Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |