OCP-IP Delivers Enhanced Transaction Generator Package
New Version Now Includes 8 New Traffic Models from Hong Kong University
BEAVERTON, Ore.--May 22, 2012 --Open Core Protocol International Partnership (OCP-IP) announces the availability of an enhanced version of their Transaction Generator (TG), which is a transaction level (TL) SystemC simulator for benchmarking network-on-chips (NoCs) used in multiprocessor system-on-chip (SoC) applications. The latest version now includes 8 new traffic models from Hong Kong University’s MCSL Benchmark Suite v1.1.
“The work on this Transaction Generator, 8 new models from Hong Kong University and DRAM package by our Network on Chip Working Group showcases co-operation and collaboration among both our industry and academic researchers, ensuring synergy advantages in the field of NoCs”
MCSL includes two kinds of traffic patterns: recorded and statistical. Both use task communication graph model which is converted into TG’s native format automatically before simulation. These models are fine-grained having dozens or even hundreds of tasks and hence are suitable for benchmarking large systems. The default mappings utilize 16, 32 and 64 processing elements. Applications include, video processing, robot controller, and more.
In addition to the eight new models from Hong Kong University, the TG also includes a basic set of 9 traffic models from the multimedia and telecommunication domain, as well as Accurate DRAM Models. Together, these integrated models enable accurate representation of performance of systems and enable a realistic evaluation of Networks on Chip.
The new TG is freely available to both OCP-IP members and non-members alike through GNU LGPL, and is an ideal addition to all system-level designers evaluating various interconnection solutions in a simulation model of a real, complex system. It can also be used to simulate IP blocks before real implementations are available which enables the design of interconnect and implementation of IP blocks and SW for processors to advance in parallel, saving time, resources, and ensuring a faster time-to-market.
“The work on this Transaction Generator, 8 new models from Hong Kong University and DRAM package by our Network on Chip Working Group showcases co-operation and collaboration among both our industry and academic researchers, ensuring synergy advantages in the field of NoCs,” said Ian Mackintosh, president and chairman of OCP-IP. “We are extremely proud to host our Working Group forum where the world’s most prestigious universities and industry researchers in the field of NoC investigation can come together.”
The Transaction Generator with DRAM model kit and 8 new models from Hong Kong University were developed by Tampere University of Technology and Royal Institute of Technology (KTH) in conjunction with members of OCP-IP’s Network on Chip Benchmarking working group including: Boston University, University of British Columbia, Carnegie Melon University, Washington State University, and Transylvania University in cooperation with industry members of the OCP-IP.
To download a copy of the Transaction Generator see, http://www.ocpip.org/tg_package.php
The Network on Chip Benchmarking Working Group has also issued an open call for Benchmarks to be distributed to researchers. NoC researchers may submit benchmarks from any application domain to be included. For more information on the call for benchmarks, please see http://www.ocpip.org/ocpspec_call_for_benchmarks.php
Institutions interested in joining the work of OCP-IP’s Network on Chip Benchmarking Working Group should contact admin@ocpip.org
For the latest information on OCP-IP, please see our free newsletter at http://www.ocpip.org/newsletters.php
About OCP-IP
Formed in 2001, OCP-IP is a non-profit corporation promoting, supporting and delivering the only openly licensed, core-centric protocol comprehensively fulfilling integration requirements of heterogeneous multicore systems. The Open Core Protocol (OCP) facilitates IP core reusability and reduces design time, risk, and manufacturing costs for all SoC and electronic designs by providing a comprehensive supporting infrastructure. For additional background and membership information, visit www.OCPIP.org.
|
Related News
- OCP-IP Delivers Enhanced Transaction Generator Package
- OCP-IP Delivers Transaction Generator Package
- OCP-IP Delivers Memory Model Package
- OCP-IP Announces Newly Enhanced Advanced Accellera Systems Initiative SystemC TLM Kit
- OCP-IP Develops New Relaxed Commercial Use License for SystemC Transaction Level Modeling Kit
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |