InterDigital Responds to Reports of Huawei European Commission Complaint
KING OF PRUSSIA, Pa.-- May 25, 2012-- InterDigital, Inc. (NASDAQ: IDCC) issued the following response to the announcement by Huawei that they filed a complaint with the European Commission, claiming abuse of patents essential to the 3G (UMTS) standard:
"InterDigital has not seen the complaint that was filed, so we can offer no specific response to whatever issues might be raised in the complaint," said Lawrence Shay, President of InterDigital's patent holding subsidiaries. "InterDigital has over 200 engineers in four research and development facilities, and participates with engineers from a broad range of industry leaders in developing and testing innovative technologies that become wireless standards. We have in the past licensed, and continue to license, technologies on the terms set forth in our commitments to those standards bodies. Our long and successful track record of licensing more than 50 companies throughout the mobile industry is proof of that commitment, and of our ability to reach mutually agreeable terms for such licenses."
Over the past three decades, InterDigital's R&D team has developed fundamental wireless technologies that have shaped the cellular industry, and has built a portfolio of over 19,500 patents and patent applications as of December 31, 2011.
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies.
|
Related News
- InterDigital Files Complaint Against Nokia, Huawei and ZTE With International Trade Commission
- InterDigital Files New Complaint Against Huawei, Nokia, Samsung and ZTE with U.S. International Trade Commission
- European Commission forms processor, semiconductor alliance
- Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission
- UK Judge Finds Conversant Wireless' European Standard-Essential Patents Infringed by Huawei and ZTE
Breaking News
- IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
- Axiomise Accelerates Formal Verification Adoption Across the Industry
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
- intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
- Sevya joins TSMC Design Center Alliance
Most Popular
- Weebit Nano nears productisation, negotiating initial customer agreements
- Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
- Sevya joins TSMC Design Center Alliance
- Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
- Open Compute Project Foundation and JEDEC Announce a New Collaboration
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |