NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Insufficient baseband chip supply hurting LTE smartphone sales
Carter L. Horney, Forward Concepts
EETimes (5/30/2012 1:22 PM EDT)
Since there has been greater than originally expected demand for LTE (Long Term Evolution) smartphones (and tablets), international vendors, including Samsung Electronics, LG Electronics and HTC are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
The main cellular carriers promoting LTE are Verizon Wireless, AT&T and Sprint in the US market, Rogers in Canada, SK Telecom, KT and LG+ in South Korea and NTT DoCoMo in Japan. LTE mobile broadband services are also available in seven countries in Western Europe.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Sequans Introduces StreamliteLTE, a New Line of Chips for the Internet of Things
- GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips
- Supply Chain Experts Weigh In on CHIPS Act
- SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups
- NIST and Google to Create New Supply of Chips for Researchers and Tech Startups
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation