Dolphin Integration selects LFoundry for defense and industrial markets
ROUSSET, FRANCE, June 11, 2012 – Dolphin Integration and LFoundry are happy to announce they are setting up a partnership for the fabrication of Dolphin’s products. These designs based on LFoundry LF 150 technology concern SOCs (Systems on Chip), ASICs (Application Specific Integrated Circuits) and FPGA to ASIC migration.
Based on LFoundry's Product Design Kit (PDK), and their technologies, Dolphin’s mixed signal circuits are dedicated to the European Defense industries as well as high-reliability markets, and are supported by Dolphin’s experience of more than 25 years in analog, logic and mixed-signal microelectronic design.
LFoundry brings to this partnership their LF150 technology, based on the 150 nm geometry. This long-standing technology has been thoroughly tested and validated by numerous LFoundry customers. Dolphin Integration has selected LFoundry for their ability to ensure the continuous delivery of their semiconductor solutions, with their flexibility to support customer needs. At LFoundry, Dolphin Integration will benefit from the company’s customer support ensuring reliable and perennial deliveries for small to large volumes.
“We are very happy to partner with LFoundry for our mixed-signal products targeting the defense and industrial markets”, said Louis Zangara, Vice-President of Dolphin Integration. “We have selected LFoundry to benefit from their experience and proximity, both factors being key for the European Defense equipment makers”.
“Our partnership with Dolphin Integration is a recognition of the quality of our services, both in terms of manufacturing and in terms of customer service. Our long-term commitment to support Dolphin’s needs has played a central role in setting up our partnership”, said Jean-Pierre Delesse, President LFoundry Rousset.
About LFoundry Rousset
With more than 650 employees, LFoundry Rousset, a semiconductor expert headquartered in Rousset, France, brings a new approach to semiconductor manufacturing. Thanks to its own expertise demonstrated by its LF 110 Flash process, combined with partnerships with the best experts in their domain, LFoundry Rousset is able to bring its customers proximity, reliability and security for their semiconductor manufacturing.
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, such as mixed signal high-resolution converters for audio and measurement applications, libraries of memories and standard cells, Power management networks, Microcontrollers.
The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own missing electronic design solutions enabling Support Engineering with Application Hardware Modeling as well as early Power and Noise assessment, plus engineering assistance for Risk Control.
|
Dolphin Semiconductor Hot IP
Related News
- Dolphin Integration reveals its unique Regulator offering for IoT markets at 55 nm
- Dolphin Integration dedicated features for shortening and easing the Industrial Test of Audio converters
- QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer
- EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |